Research progress of high thermal conductivity diamond/aluminum alloy/copper composite heat dissipating material

Abstract Synthetic diamond has become a research hotspot in the manufacture of new heat-dissipating materials due to its high thermal conductivity, low thermal expansion coefficient and relatively low price. This paper mainly introduces some research progress in the density, synthesis method, thermal conductivity and interface of diamond/aluminum alloy/copper composite heat dissipating materials this year. The addition of live carbon (boron, chromium, etc.) and the direct bonding of diamond under high pressure may be two effective ways to increase the thermal conductivity of diamond/metal heat sink materials.


Diamond and Abrasives Engineering, 2009, Issue 3

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