Central's ultra-thin diamond wire monocrystalline silicon chip project has been put into production

On March 3, Zhonghuan Co., Ltd. (002129) said on the interactive platform of investor relations that the subproject “Slim Diamond Line Monocrystalline Silicon Slicing Project” has been put into production. According to the needs of the development of the project, the CFZ zone single crystal silicon and diamond wire slicing project has changed the implementation body, and relevant procedures are being processed.

The data show that: Zhonghuan is a professional manufacturer of semiconductor discrete devices and a high-tech enterprise in Tianjin. The company's main products are high-voltage silicon reactors, silicon rectifier diodes, silicon bridge rectifiers, etc., widely used in line output transformers, color TV sets, displays, microwave ovens, air fresheners and other electronic equipment, with an annual production capacity of more than 1 billion.

The company said that Zhonghuan has the world's leading crystalline silicon technology, "Crystal silicon and ultra-thin diamond wire monocrystalline silicon wafer project for CFZ single crystal", using the world's leading CFZ technology and the world's leading diamond wire slicing technology, greatly improved Silicon wafer quality, unit silicon material yield and slicing efficiency reduce silicon wafer cutting loss. The implementation of the fund-raising investment project has achieved a technological breakthrough in silicon wafer thinning for solar energy, producing world-class semiconductor crystalline silicon rods and high-efficiency solar cell wafers at the leading level of world conversion efficiency at a lower cost.

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